Semiconductors provide the foundation for the devices that power our lives daily, from high performance to personal computing, and from industrial to mobile electronics. Driven for over 50 years by Moore’s law, which calls for the number of transistors on a chip to double every two years, metallization technologies required to manufacture semiconductor chips have been pushed to the limits of scaling. Yet the call for higher performance and reduced power at lower cost continues.

3D TSVs and Cu damascene are two key applications for semiconductor device manufacturing where aveni’s advanced metallization processes are critical to meeting next-generation requirements, offering compelling extendibility and cost advantages. aveni blasts through the limits of scaling, extending the life of Moore’s law to 10 nm and beyond.