Gearing up TSVs to solve next-generation application challenges

Gearing up TSVs to solve next-generation application challenges

Through Silicon Vias (TSVs) have been in existence for over 20 years. Although still considered by some to be a niche market, TSVs continue to find their way into various high performance devices, in spite of efforts to design them out.  Bruno Morel, aveni CEO, discusses the challenges and uses of TSVs (and alternatives), as well as aveni’s electrografting technology, and how it solves issues faced by conventional deposition techniques used for the metallization of high aspect ratio (HAR) TSVs.

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