CTO Frédéric Raynal will present aveni’s recent innovations in TSV and 3D packaging technologies during the start-up pitch session at the European 3D Summit 2016. The session will take place on January 19th.
The European 3D Summit 2016 will take place January 18–20, 2016 in Grenoble, France. In 2016 the SEMI European 3D Summit extends its scope beyond TSV to include a wider range of 3D topics, showcasing the integration of advanced packaging solutions into applications such as imaging, automotive or wearables. On 18-20 January 2016 in Grenoble (France), top speakers will present the market opportunities and technology advances in this field, and discuss what the rapid growth in this advanced packaging market means for the supply chain: OSATs, IDMs, Fabless, and material and equipment suppliers.