A metallization technology whose time has come

A metallization technology whose time has come

2015 was a year marked by through silicon via (TSV) productization for three memory applications and a push for more MEMS and sensor technologies, as connectivity goes beyond computer-to-computer to thing-to-thing. For aveni, 2015 brought a new name, and leaps forward in commercializing our wet, molecular buildup process that provides a cost-effective alternative to conventional and costly metallization technology processeslike ionized physical vapor deposition (iPVD) and atomic layer deposition (ALD) for TSV barrier and seed steps.

Read More

Click to share: Share in Linkedin Share in Facebook Share in Twitter Share in Google+