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  • What’s all the excitement about Cobalt?
  • When ECD Hits the Wall at 10nm, What Will Our Options Be for Copper Fill?
  • A metallization technology whose time has come

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What’s all the excitement about Cobalt?

What’s all the excitement about Cobalt?

Recent press releases, as well as papers presented at the June 2018 IITC conference have increased the buzz about cobalt...

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When ECD Hits the Wall at 10nm, What Will Our Options Be for Copper Fill?

When ECD Hits the Wall at 10nm, What Will Our Options Be for Copper Fill?

Despite the fact that the International Technology Roadmap for Semiconductors (ITRS) has just published its final missive and has shifted...

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A metallization technology whose time has come

A metallization technology whose time has come

2015 was a year marked by through silicon via (TSV) productization for three memory applications and a push for more...

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MEMS Executive Congress Through the Eyes of a Newcomer

MEMS Executive Congress Through the Eyes of a Newcomer

As a process technology company, aveni attends and participates in a good number of technical conferences each year. Recently, CEO...

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France
Tél. : +33(0) 1 69 75 43 43
Fax : +33(0) 1 60 11 07 52
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Judy LaCara
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News

Aveni® S.A. Demonstrates Surface Analysis of Barrier, Liner, and Seed Layers that Extend Copper Interconnects Using Alkaline Electroplating Chemistry


Recent findings validate that the company’s Sao™ copper electroplating chemistry does not impact the underlayer...
read more...

What’s all the excitement about Cobalt?


Recent press releases, as well as papers presented at the June 2018 IITC conference have...
read more...

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Massy Headquarters
15 rue du Buisson aux Fraises
91300 Massy
France
Tél. : +33(0) 1 69 75 43 43
Fax : +33(0) 1 60 11 07 52