aveni delivers innovative metallization processes that improve device performance and yield, enabling future technologies, today. Our production-ready solutions revolutionize the copper-plating process for damascene and TSV applications critical to semiconductor and MEMS device manufacturing. aveni’s Electrografting (eG™) technology is a wet, electrochemical-based process that enables the growth of extremely high-quality thin films of various types. Chemicalgrafting (cG™) is based on the same fundamental mechanisms as Electrografting, but is used on nonconductive substrates. Both technologies have been successfully demonstrated in manufacturing at and below the 14 nm node, as well as 40:1 aspect ratios.
The company was originally founded in 2001 as a spinoff from the Commissariat à l’énergie atomique et aux énergies alternatives (CEA) to develop and market groundbreaking nanometric deposition technologies for a variety of electronic applications. Since that time, aveni has partnered with several R&D centers, and leading global equipment and device manufacturers on a variety of projects. Based in Massy, France, the company has a strong team of scientists and engineers who excel in the fields of surface science, chemistry, electrochemistry, physics, materials science and semiconductors.