Metallizing tomorrow’s dimensions

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Why aveni?

aveni enables future technologies with our innovative metallization processes that improve device performance and yield, today. Traditional and expensive vacuum-based vapor-phase processes like physical vapor deposition (PVD), chemical vapor deposition (CVD) and electrochemical deposition (ECD) have reached their limits of capability, and the industry now needs a path to cost-effectively meet future feature requirements.

We overcome the roadblocks of traditional deposition technology for damascene or TSV metallization with a unique approach that revolutionizes the copper plating process. In fact, aveni is the only company in the industry able to support damascene and TSV manufacturing at 14nm and below using industry-standard processing equipment to maximize performance and yield.

aveni Is Production-Ready

aveni’s Electrografting and Chemicalgrafting processes have gone beyond R&D and are proven for manufacturing environments for a variety of applications seeking low-cost, high-quality nanometric films. Leading-edge device manufacturers worldwide have recognized aveni’s novel metallization technologies, recognizing it as manufacture-ready for dual damascene and advanced microelectronic substrates. Additionally, it has been named best-known method for TSV manufacturing.

Realize the Future of Metallization Today

By design, aveni’s proprietary Electrografting and Chemicalgrafting processes ensure metallization in the tightest spaces and over the most intricate topography. Traditional processes use deposition techniques to distribute chemistries over the wafer surface, and rely on equipment capabilities. aveni’s approach relies on molecular engineering to build up metallization films molecule by molecule. No space is too tight, no surface too rough for aveni. As the industry strives to achieve finer geometries at tighter pitches, aveni is the only company that can meet tomorrow’s requirements, today.

Our Benefits

aveni’s novel metallization process:

  • Supports nanometric film growth regardless of topography
  • Fill ultra-narrow damascene features, 14nm node and below
  • Conformally coats TSV structures at aspect ratios up to 40:1
  • Achieves superior film quality with strong bonds
  • Improves yield
  • Increases throughput
  • Reduces capex
  • Lowers overall cost of ownership


3d tsv

3D integrated circuits (3D-ICs) are manufactured by stacking ICs and using through silicon vias (TSVs) as a form of interconnect to create high-density devices. 3D TSVs shorten the path for the signal to travel from chip to chip, or one layer of circuitry to the next. The result is reduced power, increased interconnect density, and increased functionality and performance.

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Dual Damascene

Silicon scaling to perpetuate Moore’s law is extending down to the 7nm node. As such, processes used to create layers of microscopic metal interconnections are posing increased yield challenges to the damascene processes that rely on costly vapor-phase deposition technology.

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About Us

aveni, Inc. delivers innovative metallization processes that improve device performance and yield, enabling future technologies, today. The company’s production-ready solutions revolutionize the copper plating process for damascene, through silicon vias (TSVs), MEMS and others applications. ave...

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Management Team

Bruno Morel

Chief Executive Officer

Frédéric Raynal

CTO/VP Engineering

Vincent Mevellec

Sr. Director, Technology/R&D

Christophe Fitamant

Director, Business Development



Massy Headquarters
15 rue du Buisson aux Fraises
91300 Massy
Tél. : +33(0) 1 69 75 43 43
Fax : +33(0) 1 60 11 07 52
Email :

PR Contact

Amy Smith
Impress Labs